Metallization of Polymers 2
Editat de Edward Sacheren Limba Engleză Hardback – 30 sep 2002
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Specificații
ISBN-13: 9780306472534
ISBN-10: 0306472538
Pagini: 208
Ilustrații: VIII, 208 p.
Dimensiuni: 178 x 254 x 20 mm
Greutate: 0.62 kg
Ediția:2002
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
ISBN-10: 0306472538
Pagini: 208
Ilustrații: VIII, 208 p.
Dimensiuni: 178 x 254 x 20 mm
Greutate: 0.62 kg
Ediția:2002
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
New Instrumentation.- 1. Surface Analysis Using Confocal Raman Micro-spectroscopy.- 2. Ellipsometric Characterization of the Optical Constants of Metals: Thin Film versus Nanoparticle.- 3. Ultra Thin Film Analysis Using the Thermo VG Scientifics Thetaprobe Instrument.- 4. Nanoindentation of Microsprings and Microcantilevers.- Low Permittivity Materials.- 5. Physical and Interfacial Properties of Low Permittivity Polymers: Cyclotene, SiLK and Ultra-Low K.- 6. Mechanical Properties of Cured Silk Low-K Dielectric Films.- 7. Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applications.- Polymer Metallization.- 8. Fundamental Aspects of Polymer Metallization.- 9. The Study of Copper Clusters on Dow Cyclotene and Their Stability.- 10. Adsorption of Noble Metal Atoms on Polymers.- 11. Nucleation and Growth of Vapor-Deposited Metal Films on Self-Assembled Monolayers Studied by Multiple Characterization Probes.- Barrier Layers.- 12. Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallization.- 13. Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics.- 14. Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compound on Various Polymeric Substrates.- Adhesion Enhancement.- 15. Surface Modifications by Ion-Assisted Reactions.- 16. Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited Ni or Cu Films.