Cantitate/Preț
Produs

Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation

Autor Yongle Wu, Weimin Wang
en Limba Engleză Paperback – 3 iun 2024
This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. 
This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun.  This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.




 

Citește tot Restrânge

Toate formatele și edițiile

Toate formatele și edițiile Preț Express
Paperback (1) 73567 lei  38-44 zile
  Springer Nature Singapore – 3 iun 2024 73567 lei  38-44 zile
Hardback (1) 88249 lei  3-5 săpt.
  Springer Nature Singapore – 2 iun 2023 88249 lei  3-5 săpt.

Preț: 73567 lei

Preț vechi: 96798 lei
-24% Nou

Puncte Express: 1104

Preț estimativ în valută:
14083 14484$ 11684£

Carte tipărită la comandă

Livrare economică 15-21 februarie

Preluare comenzi: 021 569.72.76

Specificații

ISBN-13: 9789819914579
ISBN-10: 9819914574
Pagini: 311
Ilustrații: XV, 311 p. 693 illus., 7 illus. in color.
Dimensiuni: 155 x 235 mm
Ediția:2023
Editura: Springer Nature Singapore
Colecția Springer
Locul publicării:Singapore, Singapore

Cuprins

Introduction.- Design and Simulation of Balanced Bandpass Filter.- Design and Simulation of Millimeter-Wave Microstrip Bandpass Filter.- Design and Simulation of Input-Absorptive Bandstop Filter.- Design and Simulation of Impedance-Transforming Power Divider.- Design and Simulation of Bandpass Filtering Marchand Balun.

Notă biografică

Prof. Yongle Wu received his Ph.D. degree in electronic engineering from Beijing University of Posts and Telecommunications (BUPT), China, in 2011. He was a Research Assistant at the City University of Hong Kong (CityU) from April to October 2010. Prof Wu is currently a Professor with the School of Integrated Circuits, BUPT. His research interests include integrated circuits, microwave components, antennas, and wireless systems design.

Weimin Wang received the M.S. degree in Electromagnetic Field and Microwave Technology and the Ph. D. degree in Electronic Science and Technology from Beijing University of Posts and Telecommunications (BUPT), in 2004 and 2014 She is currently an Associate Professor in the School of Electronic Engineering, BUPT. Her research interests include electromagnetic field, antennas, microwave circuits and antenna measurement.

Textul de pe ultima copertă

This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. 
This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun.  This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.
  

Caracteristici

Takes five representative microwave and millimeter-wave passive chips based on TFIPD technology as examples Combines the theoretical basis with engineering practice Aims at the design and simulation of microwave and millimeter-wave chips