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Modeling of Adhesively Bonded Joints de Lucas F. M. da Silva

Modeling of Adhesively Bonded Joints

Editat de Lucas F. M. da Silva
en Limba Engleză Hardback – 13 iun 2008
A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.
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Specificații

ISBN-13: 9783540790556
ISBN-10: 3540790551
Pagini: 348
Ilustrații: X, 335 p.
Dimensiuni: 156 x 235 x 27 mm
Greutate: 0.66 kg
Ediția:2008
Editura: Springer Berlin, Heidelberg
Colecția Springer
Locul publicării:Berlin, Heidelberg, Germany

Public țintă

Research

Descriere

A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.

Cuprins

Analytical Modeling.- Simple Lap Joint Geometry.- Analysis of Cracked Lap Shear (CLS) Joints.- Analytical Models with Stress Functions.- Numerical Modeling.- Complex Constitutive Adhesive Models.- Complex Joint Geometry.- Progressive Damage Modelling.- Modelling Fatigue in Adhesively Bonded Joints.- Environmental Degradation.- Non-Linear Thermal Stresses in Adhesive Joints.- Impact.- Stress Analysis of Bonded Joints by Boundary Element Method.

Textul de pe ultima copertă

A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.

Caracteristici

Must have due to many recent developments in adhesive technologies
Strongly expanding field in industrial applications
Includes supplementary material: sn.pub/extras