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More than Moore Technologies for Next Generation Computer Design

Editat de Rasit O. Topaloglu
en Limba Engleză Hardback – 10 feb 2015
This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
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Specificații

ISBN-13: 9781493921621
ISBN-10: 1493921622
Pagini: 250
Ilustrații: IX, 218 p. 116 illus., 63 illus. in color.
Dimensiuni: 155 x 235 x 17 mm
Greutate: 0.5 kg
Ediția:2015
Editura: Springer
Colecția Springer
Locul publicării:New York, NY, United States

Public țintă

Professional/practitioner

Cuprins

Impact of TSV and Device Scaling on the Quality of 3D Ics.- 3D Integration Technology.- Design and Optimization of Spin-Transfer Torque MRAMs.- Embedded STT-MRAM: Device and Design.- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis.- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors.- Design Automation for On-chip Nanophotonic Integration.

Notă biografică

Rasit O. Topaloglu is an Advisory R&D Engineer at IBM.

Textul de pe ultima copertă

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance.  Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore's Law”.  Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Caracteristici

Introduces novel memories, using new materials and processing techniques, offering many advantages over dynamic memories such as traditional SRAM and e-DRAM Describes 3D integration of integrated circuits, enabling stacking of layers and shrinking device to device distance over traditional packages Enables readers to use on-chip integrated optics for interconnect Includes coverage of technology, design, and design automation