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Packaging of High Power Semiconductor Lasers de Xingsheng Liu

Packaging of High Power Semiconductor Lasers: Micro- and Opto-Electronic Materials, Structures, and Systems

Autor Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
en Limba Engleză Hardback – 15 iul 2014
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
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Specificații

ISBN-13: 9781461492627
ISBN-10: 1461492629
Pagini: 400
Ilustrații: XV, 402 p. 497 illus., 386 illus. in color.
Dimensiuni: 155 x 235 x 22 mm
Greutate: 0.84 kg
Ediția:2015
Editura: Springer
Colecția Springer
Seria Micro- and Opto-Electronic Materials, Structures, and Systems

Locul publicării:New York, NY, United States

Public țintă

Research

Cuprins

Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.

Notă biografică

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Textul de pe ultima copertă

This book introduces high power semiconductor laser packaging design.  The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors.  New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

Caracteristici

Describes packaging design for high power semiconductor lasers Details prevention techniques for thermal stress failures Discusses most recent technology trends in semiconductor laser packaging