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Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces

Autor Nicole Lindenmann
en Limba Engleză Paperback – 8 oct 2020
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.

This work was published by Saint Philip Street Press pursuant to a Creative Commons license permitting commercial use. All rights not granted by the work's license are retained by the author or authors.

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Specificații

ISBN-13: 9781013279041
ISBN-10: 1013279042
Pagini: 252
Dimensiuni: 216 x 280 x 13 mm
Greutate: 0.59 kg
Editura: Saint Philip Street Press