Microelectronics Packaging Handbook: Subsystem Packaging Part III
Autor R.R. Tummala et al.
30 ian 1997
Hardback
Preț: 1007.94 lei 1259.92 lei
6-8 săpt.
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R.R. Tummala
Electronic Packaging for High Reliability, Low Cost Electronics
Editat de R.R. Tummala et al.
3 dec 2010
Paperback
Preț: 787.24 lei 1035.84 lei
39-44 zile
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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging
Autor R.R. Tummala et al.
30 ian 1997
Carte
Preț: 1341.67 lei 1677.08 lei
Indisponibil temporar
-20%