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RF and Microwave Microelectronics Packaging de Ken Kuang

RF and Microwave Microelectronics Packaging

Editat de Ken Kuang, Franklin Kim, Sean S. Cahill
en Limba Engleză Hardback – 17 noi 2009
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Specificații

ISBN-13: 9781441909831
ISBN-10: 1441909834
Pagini: 304
Ilustrații: XVI, 285 p.
Dimensiuni: 155 x 235 x 34 mm
Greutate: 0.6 kg
Ediția:2010
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States

Public țintă

Professional/practitioner

Cuprins

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.

Textul de pe ultima copertă

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:
  • Presents methods and techniques used for measuring and testing of the electronic materials properties.
  • Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
  • Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
  • Discusses thermal management issues for RF/MW packaging.
  • Creates a RF/Microwave Packaging Roadmap for Portable Devices.

Caracteristici

Presents methods and techniques used for measuring and testing of the electronic materials properties Presents an in-depth discussion of ceramic materials for RF/MW packaging Presents numerical simulation methods and techniques used in analysis of electronic devices and materials Discusses thermal management issues for RF/MW packaging Presents a RF/Microwave Packaging Roadmap for Portable Devices Includes supplementary material: sn.pub/extras