State-of-the-Art of Millimeter-Wave Silicon Technology: Lecture Notes in Electrical Engineering, cartea 945
Autor Jaco du Preez, Saurabh Sinhaen Limba Engleză Hardback – 21 sep 2022
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Specificații
ISBN-13: 9783031146541
ISBN-10: 3031146549
Pagini: 160
Ilustrații: VII, 160 p. 96 illus., 6 illus. in color.
Dimensiuni: 155 x 235 mm
Greutate: 0.46 kg
Ediția:1st ed. 2022
Editura: Springer International Publishing
Colecția Springer
Seria Lecture Notes in Electrical Engineering
Locul publicării:Cham, Switzerland
ISBN-10: 3031146549
Pagini: 160
Ilustrații: VII, 160 p. 96 illus., 6 illus. in color.
Dimensiuni: 155 x 235 mm
Greutate: 0.46 kg
Ediția:1st ed. 2022
Editura: Springer International Publishing
Colecția Springer
Seria Lecture Notes in Electrical Engineering
Locul publicării:Cham, Switzerland
Cuprins
Evolution of Millimeter-Wave Silicon Technology.- Millimeter-Wave Silicon Passive Components.- Active Millimeter-Wave Silicon Devices.- Passive Circuits and Building Blocks in Millimeter-Wave Silicon.
Notă biografică
Saurabh Sinha is full professor of Electronics at the University of Johannesburg, South Africa, where he has been Executive Dean of the Faculty of Engineering and Built Environment since 2013. In addition he is the managing editor of the South African Institute of Electrical Engineers (SAIEE) Africa Research Journal.
Textul de pe ultima copertă
This book examines the critical differences between current and next-generation Si technologies (CMOS, BiCMOS and SiC) and technology platforms (e.g. system-on-chip) in mm-wave wireless applications. We provide a basic overview of the two technologies from a technical standpoint, followed by a review of the state-of-the-art of several key building blocks in wireless systems. The influences of system requirements on the choice of semiconductor technology are vital to understanding the merits of CMOS and BiCMOS devices – e.g., output power, battery life, adjacent channel interference, cost restrictions, and so forth. These requirements, in turn, affect component-level design and performance metrics of oscillators, mixers, power and low-noise amplifiers, as well as phase-locked loops and data converters. Finally, the book offers a peek into the next generation of wireless technologies such as THz -band systems and future 6G applications.
Caracteristici
Reviews the next-generation SiGe BiCMOS and CMOS technology Demonstrates the low fabrication cost and unprecedented integration capability of CMOS and BiCMOS Provides essential theoretical background information