Theory and Practice of Thermal Transient Testing of Electronic Components
Editat de Marta Rencz, Gábor Farkas, András Poppeen Limba Engleză Paperback – 24 ian 2024
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Specificații
ISBN-13: 9783030861766
ISBN-10: 3030861767
Pagini: 385
Ilustrații: IX, 385 p.
Dimensiuni: 155 x 235 mm
Greutate: 0.55 kg
Ediția:1st ed. 2022
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland
ISBN-10: 3030861767
Pagini: 385
Ilustrații: IX, 385 p.
Dimensiuni: 155 x 235 mm
Greutate: 0.55 kg
Ediția:1st ed. 2022
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland
Cuprins
Introduction: the Importance and Motivation.- Theoretical Background: History, the Network Identification by Deconvolution (NID) Method, Structure Functions, the Thermal Signature.- The Use of Thermal Transient Testing.- General Practical Questions and the Flow of Thermal Transient Measurements.- On the Accuracy and Repeatability of Thermal Measurements.
Notă biografică
Márta Rencz, Ph.D., is a Professor and former Head of the Department of Electron Devices at the Budapest University of Technology and Economics. Dr. Rencz also holds a Research Director position with Mentor, a Siemens Business. She received her undergraduate and master’s degrees in electrical engineering and a Ph.D. from the Technical University of Budapest, Hungary, a Doctor of Science degree from The Hungarian Academy of Science, and a Doctor Honoris Causa degree from the Technical University of Tallinn. Her latest research interests include the thermal investigation of ICs and MEMS, thermal sensors, thermal testing, thermal simulation, multiphysics model generation, and electro-thermal simulation. Dr. Rencz received the Harvey Rosten Award of Excellence for her research results in thermal modeling and the ASME Allan Krauss Thermal Management Medal for her contributions to the scientific and academic world of thermal transient testing, in particular, her work on thermal metrology, including thermal test, characterization, and analysis of semiconductor devices and packages. She is a Program Committee member for several international conferences and workshops and a guest editor of special issues at leading scientific journals. She has published her theoretical and practical results in more than 350 technical papers.
Gábor Farkas, Ph.D., received his MSc in electrical engineering in 1976 and his Ph.D. in 1981 at the Budapest University of Technology and Economics, Hungary, specializing in technical physics. Since then, Dr. Farkas has worked in various fields of microelectronics, from device design to circuit testing. He was visiting scholar at several European universities. His current research focus is on testing high-power devices. He has published his research results in over 100 technical papers.
András Poppe, Ph.D., received his MSc in electrical engineering in 1986 and his Ph.D. in 1996 at the Budapest University of Technology and Economics, Hungary, where he currently works as a professor. In 2019 he obtained a Doctor of the MTA degree from the Hungarian Academy of Science. Dr. Poppe‘s research interest is modeling and testing devices in microelectronics, focusing on LEDs. He is actively working in various standardization committees to help standardize testing devices in electronics. He has published his research results in over 200 technical papers.
Textul de pe ultima copertă
This book discusses the major aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book begins by presenting the theoretical background of creating structure functions from the measured results with mathematical details. It then moves on to show how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and the calibration of simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The special problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide band gap materials, and LEDs are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
- The first book dedicated solely to thermal transient testing;
- Enables readers to accomplish thermal transient testing on any type of electronics;
- Provides valuable use cases and highlights the specialties of characterizing different devices.
Caracteristici
The first book dedicated solely to thermal transient testing Enables readers to accomplish thermal transient testing on any type of electronics Provides valuable use cases and highlights the specialties of characterizing different devices