Thermal Design of Electronic Equipment: Electronics Handbook Series
Autor Ralph Remsburgen Limba Engleză Hardback – 27 sep 2000
Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
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Specificații
ISBN-13: 9780849300820
ISBN-10: 0849300827
Pagini: 396
Ilustrații: 63 tables and 998 equations
Dimensiuni: 156 x 234 x 26 mm
Greutate: 0.81 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Electronics Handbook Series
ISBN-10: 0849300827
Pagini: 396
Ilustrații: 63 tables and 998 equations
Dimensiuni: 156 x 234 x 26 mm
Greutate: 0.81 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Electronics Handbook Series
Public țintă
ProfessionalCuprins
Preface. Nomenclature and Symbology. Unit Conversion Factors. Introduction to Formulas for Thermal Design of Electronic Equipment. Formulas for Conduction Heat Transfer in Electronic Equipment. Formulas for Fluid Dynamics for Electronic Equipment. Convection Heat Transfer in Electronic Equipment. Radiation Heat Transfer in Electronic Equipment. Heat Transfer with Phase Change. Combined Modes of Heat Transfer for Electronic Equipment. Appendix.
Descriere
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing a variety of problems. Thermal Design of Electronic Equipment specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.