The Electronic Packaging Handbook: Electronics Handbook Series
Editat de Glenn R. Blackwellen Limba Engleză Hardback – 29 noi 1999
The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.
Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.
Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Preț: 1653.72 lei
Preț vechi: 2016.74 lei
-18% Nou
Puncte Express: 2481
Preț estimativ în valută:
316.58€ • 325.59$ • 262.64£
316.58€ • 325.59$ • 262.64£
Carte tipărită la comandă
Livrare economică 19 februarie-05 martie
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9780849385919
ISBN-10: 0849385911
Pagini: 638
Ilustrații: 152 equations; 64 Tables, black and white
Dimensiuni: 178 x 254 x 40 mm
Greutate: 1.27 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Electronics Handbook Series
ISBN-10: 0849385911
Pagini: 638
Ilustrații: 152 equations; 64 Tables, black and white
Dimensiuni: 178 x 254 x 40 mm
Greutate: 1.27 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Electronics Handbook Series
Public țintă
ProfessionalCuprins
Fundamentals of the Design Process. Surface Mount Technology. Integrated Circuit Packages. Direct Chip Attach. Circuit Boards. EMC and PCB Design. Hybrid Assemblies. Interconnects. Design for Test. Adhesive and Its Application. Thermal Management. Testing. Inspection. Package/Enclosure. Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach. Product Safety and Third-Party Certification. Appendix A: Definitions. Index.
Recenzii
"…highly recommended…enough detail…provides essential factural information on the design, manufacturing, and testing of electronic devices and systems…this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products…The book ties together well with references between chapters…well written and edited…each chapter includes a section of bibliographic references and suggested readings."
--Dave Fish, Pandion Electronics, Inc., SMTnet.com
--Dave Fish, Pandion Electronics, Inc., SMTnet.com
Descriere
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. As the demand for smaller, faster, and lighter products continues, electronic packaging includes a widening range of evolving topics and technologies.