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Ultra-thin Chip Technology and Applications de Joachim Burghartz

Ultra-thin Chip Technology and Applications

Editat de Joachim Burghartz
en Limba Engleză Hardback – 19 noi 2010
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
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Specificații

ISBN-13: 9781441972750
ISBN-10: 1441972757
Pagini: 450
Ilustrații: XXII, 467 p.
Dimensiuni: 155 x 235 x 28 mm
Greutate: 0.82 kg
Ediția:2011
Editura: Springer
Colecția Springer
Locul publicării:New York, NY, United States

Public țintă

Research

Cuprins

Fabrication technologies for ultra-thin chips.- Post-processing techniques and issues.- Properties of ultra-thin chips; Applications.

Textul de pe ultima copertă

Ultra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas;•Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips;•Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips;•Shows that thin chip technology and its applications represents a new paradigm in silicon technology.

Caracteristici

Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; Compares strengths and weaknesses of three leading, generic fabrication processes for ultra-thin chips; Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips Includes supplementary material: sn.pub/extras