Ultra-wide Bandgap Semiconductor Materials: Materials Today
Editat de Meiyong Liao, Bo Shen, Zhanguo Wangen Limba Engleză Paperback – 18 iun 2019
- Provides a one-stop resource on the most promising ultra-wide bandgap semiconducting materials, including high-Al-content AlGaN, diamond, β-Ga2O3, boron nitrides, and low-dimensional materials
- Presents comprehensive coverage, from materials growth and properties, to device design, fabrication and performance
- Features the most relevant applications, including power electronics, RF electronics and DUV optoelectronics
Din seria Materials Today
- 29% Preț: 1069.88 lei
- 26% Preț: 935.68 lei
- 15% Preț: 508.84 lei
- 26% Preț: 1058.04 lei
- 23% Preț: 910.79 lei
- 22% Preț: 684.58 lei
- 28% Preț: 998.35 lei
- 24% Preț: 1429.32 lei
- 24% Preț: 899.23 lei
- 24% Preț: 902.99 lei
- 24% Preț: 1127.66 lei
- 20% Preț: 1120.89 lei
- 24% Preț: 1191.02 lei
- 24% Preț: 1073.30 lei
- 27% Preț: 686.99 lei
- 27% Preț: 1569.91 lei
- 27% Preț: 1266.33 lei
- 27% Preț: 1556.97 lei
Preț: 1069.96 lei
Preț vechi: 1509.35 lei
-29% Nou
Puncte Express: 1605
Preț estimativ în valută:
204.77€ • 212.70$ • 170.09£
204.77€ • 212.70$ • 170.09£
Carte tipărită la comandă
Livrare economică 27 ianuarie-10 februarie 25
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9780128154687
ISBN-10: 0128154683
Pagini: 503
Dimensiuni: 191 x 235 mm
Greutate: 0.86 kg
Editura: ELSEVIER SCIENCE
Seria Materials Today
ISBN-10: 0128154683
Pagini: 503
Dimensiuni: 191 x 235 mm
Greutate: 0.86 kg
Editura: ELSEVIER SCIENCE
Seria Materials Today
Cuprins
1. Al-rich AlGaN semiconductor materials and their device applications 2. Semiconductor diamond 3. Ga2O3–> Progress in semiconductor β-Ga2O3 4. Recent progress of boron nitrides 5. Nanostructures based on UWBG materials
Recenzii
"This book provides recent progress of the development of new UWBS materials and shows the advantages of these materials over existing WBS materials. It provides in-depth technical details on the latest developments of efficiency, and performance of power UWBS materials as well as device per electronic devices." --IEEE