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New Materials and Devices Enabling 5G Applications and Beyond: Materials Today

Editat de Nadine Collaert
en Limba Engleză Paperback – 24 ian 2024
New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures, and enabling integration schemes for 5G applications and emerging technologies. The book gives a comprehensive overview of the tradeoffs, challenges, and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for different functions, both conventional and more exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. It is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering, and circuit design.


  • Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies
  • Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.)
  • Focuses on mm-wave frequencies up to the terahertz regime
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Specificații

ISBN-13: 9780128228234
ISBN-10: 0128228237
Pagini: 368
Ilustrații: 260 illustrations (80 in full color)
Dimensiuni: 191 x 235 x 20 mm
Greutate: 0.77 kg
Editura: ELSEVIER SCIENCE
Seria Materials Today


Public țintă

Materials Scientists & Engineers
Electrical/Optical Engineers

Cuprins

1. Introduction to 5G applications and beyond
2. FD-SOI and RF-SOI technologies for 5G
3. Radio frequency FinFT technology
4. Gallium nitride technologies for wireless communication
5. Heterojunction bipolar transistors for sub-THz application
6. InP-based technologies for 5G and beyond
7. RF-MEMS for 5G: switch, reconfigurable passive networks
8. Antenna-in-package design
9. Circuits for 5G applications implemented in fully depleted silicon-oninsulator
(SOI) and radio frequency/partially depleted SOI technologies
10. Power amplifiers monolithic microwave integrated circuit design for 5G applications