Functional Metamaterials and Metadevices Springer Series in Materials Science, nr. 262 Autor Xingcun Colin Tong 22 sep 2017 Hardback Preț: 1004.99 lei 1225.59 lei 6-8 săpt. -18%
Advanced Materials for Thermal Management of Electronic Packaging Springer Series in Advanced Microelectronics, nr. 30 Autor Xingcun Colin Tong 25 feb 2013 Paperback Preț: 1559.80 lei 1902.19 lei 6-8 săpt. -18%
Advanced Materials and Design for Electromagnetic Interference Shielding Autor Xingcun Colin Tong 19 noi 2008 Hardback Preț: 1223.61 lei 1492.21 lei 6-8 săpt. -18%