Functional Metamaterials and Metadevices Springer Series in Materials Science, nr. 262 Autor Xingcun Colin Tong 22 sep 2017 Hardback Preț: 984.62 lei 1200.75 lei 43-57 zile -18%
Advanced Materials for Thermal Management of Electronic Packaging Springer Series in Advanced Microelectronics, nr. 30 Autor Xingcun Colin Tong 25 feb 2013 Paperback Preț: 1528.13 lei 1863.57 lei 43-57 zile -18%
Advanced Materials and Design for Electromagnetic Interference Shielding Autor Xingcun Colin Tong 19 noi 2008 Hardback Preț: 1198.80 lei 1461.95 lei 43-57 zile -18%