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Advances in 3D Integrated Circuits and Systems: Series on Emerging Technologies in Circuits and Systems, cartea

Autor Hao Yu, Chuan Seng Tan
en Limba Engleză Paperback – 27 oct 2015
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
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  World Scientific Publishing Company – 27 oct 2015 79186 lei  6-8 săpt.

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Specificații

ISBN-13: 9789814699013
ISBN-10: 9814699012
Pagini: 392
Dimensiuni: 152 x 226 x 23 mm
Greutate: 0.57 kg
Editura: World Scientific Publishing Company
Seria Series on Emerging Technologies in Circuits and Systems