Microelectronics Packaging Handbook: Subsystem Packaging Part III
Autor R.R. Tummala et al.
30 ian 1997
Hardback
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Cărți de Alan G. Klopfenstein
Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging
Autor R.R. Tummala et al.
30 ian 1997
Carte
Preț: 1341.62 lei 1677.02 lei
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