Cărți de Alan G. Klopfenstein

Microelectronics Packaging Handbook: Subsystem Packaging Part III

Autor R.R. Tummala et al.

30 ian 1997

Preț: 1007^.94 lei 1259^.92 lei

6-8 săpt.

-20%

Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging

Autor R.R. Tummala et al.

30 ian 1997

Preț: 1341^.70 lei 1677^.12 lei

Indisponibil temporar

-20%