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BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage: Woodhead Publishing Series in Electronic and Optical Materials

Autor Chenming Hu, Harshit Agarwal, Chetan Gupta, Yogesh Singh Chauhan
en Limba Engleză Paperback – 3 mai 2023
BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage provides in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures, addressing geometrical scaling, temperatures, and more. There is also a dedicated chapter on extensive quality testing procedures and experimental results. This book discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia.
Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.


  • Reviews the latest advances in fabrication methods for metal chalcogenide-based biosensors
  • Discusses the parameters of biosensor devices to aid in materials selection
  • Provides readers with a look at the chemical and physical properties of reactive metals, noble metals, transition metals chalcogenides and their connection to biosensor device performance
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Specificații

ISBN-13: 9780323856775
ISBN-10: 0323856772
Pagini: 270
Ilustrații: Approx. 200 illustrations (200 in full color)
Dimensiuni: 152 x 229 x 19 mm
Greutate: 0.37 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials


Cuprins

1. Background
2. BSIM-BULK Core Model
3. Real Device Effects
4. Leakage current and thermal effects
5. BSIM-BULK Charge and Capacitance Model
6. Noise and RF Modeling
7. Junction Diode and Layout Dependent Parasitic Model
8. Compact Modeling of High Voltage Devices
9. Parameter Extraction
10. BSIM-BULK Model Quality Testing