BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage: Woodhead Publishing Series in Electronic and Optical Materials
Autor Chenming Hu, Harshit Agarwal, Chetan Gupta, Yogesh Singh Chauhanen Limba Engleză Paperback – 3 mai 2023
Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.
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Specificații
ISBN-13: 9780323856775
ISBN-10: 0323856772
Pagini: 270
Ilustrații: Approx. 200 illustrations (200 in full color)
Dimensiuni: 152 x 229 x 19 mm
Greutate: 0.37 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
ISBN-10: 0323856772
Pagini: 270
Ilustrații: Approx. 200 illustrations (200 in full color)
Dimensiuni: 152 x 229 x 19 mm
Greutate: 0.37 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
Cuprins
1. Background
2. BSIM-BULK Core Model
3. Real Device Effects
4. Leakage current and thermal effects
5. BSIM-BULK Charge and Capacitance Model
6. Noise and RF Modeling
7. Junction Diode and Layout Dependent Parasitic Model
8. Compact Modeling of High Voltage Devices
9. Parameter Extraction
10. BSIM-BULK Model Quality Testing
2. BSIM-BULK Core Model
3. Real Device Effects
4. Leakage current and thermal effects
5. BSIM-BULK Charge and Capacitance Model
6. Noise and RF Modeling
7. Junction Diode and Layout Dependent Parasitic Model
8. Compact Modeling of High Voltage Devices
9. Parameter Extraction
10. BSIM-BULK Model Quality Testing