Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling
Autor Y.-L. Shenen Limba Engleză Paperback – 20 noi 2014
Toate formatele și edițiile | Preț | Express |
---|---|---|
Paperback (1) | 917.27 lei 6-8 săpt. | |
Springer Us – 20 noi 2014 | 917.27 lei 6-8 săpt. | |
Hardback (1) | 923.08 lei 6-8 săpt. | |
Springer Us – 18 aug 2010 | 923.08 lei 6-8 săpt. |
Preț: 917.27 lei
Preț vechi: 1118.62 lei
-18% Nou
Puncte Express: 1376
Preț estimativ în valută:
175.56€ • 182.98$ • 146.15£
175.56€ • 182.98$ • 146.15£
Carte tipărită la comandă
Livrare economică 06-20 ianuarie 25
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9781489986122
ISBN-10: 148998612X
Pagini: 292
Ilustrații: IX, 281 p.
Dimensiuni: 155 x 235 x 15 mm
Greutate: 0.41 kg
Ediția:2010
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
ISBN-10: 148998612X
Pagini: 292
Ilustrații: IX, 281 p.
Dimensiuni: 155 x 235 x 15 mm
Greutate: 0.41 kg
Ediția:2010
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
Public țintă
ResearchDescriere
"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme.Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Cuprins
Mechanics Preliminaries.- Thin Continuous Films.- Patterned Films in Micro-devices.- Electronic Packaging Structures.- Heterogeneous Materials.- Challenges and Outlook.
Notă biografică
Yu-Lin Shen is currently Professor and Interim Chair in the Department of Mechanical Engineering at University of New Mexico. He received his Ph.D. in engineering from Brown University in 1994, and was a post-doctoral research associate at Massachusetts Institute of Technology before joining the faculty of University of New Mexico in 1996. Professor Shen is widely recognized for his research in mechanical behavior of materials, especially in modeling. His numerical modeling experience spans disparate length scales from the continuum level down to atomistics, focusing on mechanical issues related to thin films, composite materials and microelectronic devices and packages. He has published over 140 research papers in these areas, mostly in international journals. In 2005 Professor Shen was elected Fellow of the American Society of Mechanical Engineers (ASME).
Textul de pe ultima copertă
"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" presents an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme.Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Caracteristici
Presents constrained deformation capabilities in thin films and small-volume materials
Links the microelectronics and composite materials fields through common principles and proper analytical approaches
Provides a modeling and mechanical analyses of advanced micro- and nanostructures appealing to numerical modeling and experimentalist communities alike
Links the microelectronics and composite materials fields through common principles and proper analytical approaches
Provides a modeling and mechanical analyses of advanced micro- and nanostructures appealing to numerical modeling and experimentalist communities alike