Defect Recognition and Image Processing in Semiconductors 1997: Proceedings of the seventh conference on Defect Recognition and Image Processing, Berlin, September 1997: Institute of Physics Conference Series
Autor J. Doneker, I. Rechenbergen Limba Engleză Hardback – 1998
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Specificații
ISBN-13: 9780750305006
ISBN-10: 0750305002
Pagini: 524
Dimensiuni: 156 x 234 x 30 mm
Greutate: 0.98 kg
Ediția:1997
Editura: CRC Press
Colecția CRC Press
Seria Institute of Physics Conference Series
ISBN-10: 0750305002
Pagini: 524
Dimensiuni: 156 x 234 x 30 mm
Greutate: 0.98 kg
Ediția:1997
Editura: CRC Press
Colecția CRC Press
Seria Institute of Physics Conference Series
Public țintă
ProfessionalCuprins
Preface. Glossary. Nanoscanning (9 papers). Electron beam methods (9 papers). Optical methods (8 papers). Mapping (10 papers). X-ray methods (4 papers). Other and combined methods (8 papers). Image processing. Standardization. Si and SiGe mixed crystals (15 papers). SiC (3 papers). GaN (6 papers). Other III-V compounds (12 papers). II-VI compounds, phosphors, oxides and alternative substrates (4 papers). Processing and defects (3 papers). Defect recognition in devices and degradation (11 papers). Author and subject indices.
Recenzii
listed in SPIE-OE Reports No 174, 1998
listed in Scitech Book News, September 1998
Abstracted in INSPEC Database.
in SPIE-OE Reports No 174, 1998
listed in Scitech Book News, September 1998
Abstracted in INSPEC Database.
listed in Scitech Book News, September 1998
Abstracted in INSPEC Database.
in SPIE-OE Reports No 174, 1998
listed in Scitech Book News, September 1998
Abstracted in INSPEC Database.
Descriere
This book provides a valuable overview of current techniques used to assess, monitor, and characterize defects from the atomic scale to inhomogeneities in complete silicon wafers. It addresses advances in defect analyzing techniques and instrumentation and their application to substrates, epilayers, and devices. The book discusses the merits and limits of characterization techniques; standardization; correlations between defects and device performance, including degradation and failure analysis; and the adaptation and application of standard characterization techniques to new materials. This volume also examines the impressive advances made possible by the increase in the number of nanoscale scanning techniques now available.