Design and Modeling for 3D ICS and Interposers: From Astrophysical Black Holes to Analogous Systems in Lab: Wspc Series in Advanced Integration and Packaging, cartea 2
Autor Madhavan Swaminathanen Limba Engleză Hardback – 23 dec 2013
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Specificații
ISBN-13: 9789814508599
ISBN-10: 9814508594
Pagini: 380
Dimensiuni: 152 x 229 x 25 mm
Greutate: 0.66 kg
Editura: World Scientific Publishing Company
Seria Wspc Series in Advanced Integration and Packaging
ISBN-10: 9814508594
Pagini: 380
Dimensiuni: 152 x 229 x 25 mm
Greutate: 0.66 kg
Editura: World Scientific Publishing Company
Seria Wspc Series in Advanced Integration and Packaging
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