Cost Analysis of Electronic Systems Wspc Series in Advanced Integration and Packaging, nr. 1 Autor Peter Sandborn 6 noi 2012 Hardback Preț: 865.18 lei 1055.09 lei 6-8 săpt. -18%
Design and Modeling for 3D ICS and Interposers: From Astrophysical Black Holes to Analogous Systems in Lab Wspc Series in Advanced Integration and Packaging, nr. 2 Autor Madhavan Swaminathan 23 dec 2013 Hardback Preț: 751.07 lei 915.94 lei 6-8 săpt. -18%
Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research Wspc Series in Advanced Integration and Packaging, nr. 3 Editat de Madhusudan Iyengar et al. 26 aug 2014 Hardback Preț: 930.33 lei 1134.55 lei 6-8 săpt. -18%
Co-Design and Modelling for Advanced Integration and Packaging: Manufacturing and Reliability Wspc Series in Advanced Integration and Packaging, nr. Autor Christopher Bailey et al. 30 dec 2016 Hardback Preț: 743.17 lei 965.16 lei Nepublicat încă -23%
Embedded Dielectrics for Electronic Packaging Wspc Series in Advanced Integration and Packaging, nr. Autor Shuhui Yu et al. 30 dec 2016 Hardback Preț: 743.17 lei 965.16 lei Nepublicat încă -23%
Cost Analysis of Electronic Systems (Second Edition) Wspc Series in Advanced Integration and Packaging, nr. Autor Peter Sandborn 2 feb 2017 Hardback Preț: 1132.75 lei 1381.40 lei 6-8 săpt. -18%