Ductile Mode Cutting of Brittle Materials: Springer Series in Advanced Manufacturing
Autor Kui Liu, Hao Wang, Xinquan Zhangen Limba Engleză Hardback – 30 ian 2020
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Specificații
ISBN-13: 9789813298354
ISBN-10: 9813298359
Ilustrații: XXIV, 291 p.
Dimensiuni: 155 x 235 mm
Greutate: 0.63 kg
Ediția:1st ed. 2020
Editura: Springer Nature Singapore
Colecția Springer
Seria Springer Series in Advanced Manufacturing
Locul publicării:Singapore, Singapore
ISBN-10: 9813298359
Ilustrații: XXIV, 291 p.
Dimensiuni: 155 x 235 mm
Greutate: 0.63 kg
Ediția:1st ed. 2020
Editura: Springer Nature Singapore
Colecția Springer
Seria Springer Series in Advanced Manufacturing
Locul publicării:Singapore, Singapore
Cuprins
Introduction.- Mechanisms of ductile mode cutting of brittle materials.- Ductile mode cutting characteristics.- Modeling of ductile mode cutting of brittle materials.- Molecular dynamic simulation of ductile mode cutting.- Ductile mode cutting of silicon.- Ductile mode cutting of glass.- Ductile mode cutting of tungsten carbide.- Ductile mode cutting of calcium fluoride.- Ultrasonic vibration assisted ductile mode cutting.- Thermally assisted ductile mode cutting.- Summary.
Recenzii
Notă biografică
Textul de pe ultima copertă
This book provides a systematic and comprehensive interdisciplinary overview of ductile mode cutting of brittle materials, covering a range of topics from the fundamental physics to engineering practices. Discussing the machining mechanics and material properties, it explains the fundamental mechanism of ductile-to-brittle transition in the cutting of brittle materials. It also presents theoretical modeling and molecular dynamic simulation to demonstrate that ductile mode cutting can be achieved under certain conditions, as well as extensive experimental studies that produced smooth and damage-free surfaces on different materials, such as silicon, glass, tungsten carbide and calcium fluoride. Lastly, it explores how the ductile mode cutting performance and machinability of brittle materials can be further improved by hybrid machining processes like ultrasonic vibration and thermal-assisted cutting technologies in order to meet industry demands.
Caracteristici
Provides insights into the fundamental mechanism in ductile mode cutting of brittle materials such as silicon, glass, tungsten carbide, and calcium fluoride Introduces advanced hybrid machining processes such as ultrasonic vibration and thermal- assisted machining to enhance machinability Presents comprehensive modeling and molecular dynamic simulation of the new ductile mode cutting manufacturing processes