Electronic Packaging and Interconnects

High-Frequency Characterization of Electronic Packaging

Electronic Packaging and Interconnects, nr. 1

Autor Luc Martens

31 oct 1998

Preț: 638^.89 lei 751^.64 lei

6-8 săpt.

-15%

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Electronic Packaging and Interconnects, nr. 2

Autor Dean L. Monthei

30 noi 1998

Preț: 644^.49 lei 758^.23 lei

6-8 săpt.

-15%