Electronic Packaging and Interconnects

High-Frequency Characterization of Electronic Packaging

Electronic Packaging and Interconnects, nr. 1

Autor Luc Martens

31 oct 1998

Preț: 634^.19 lei 746^.11 lei

43-57 zile

-15%

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Electronic Packaging and Interconnects, nr. 2

Autor Dean L. Monthei

30 noi 1998

Preț: 639^.74 lei 752^.64 lei

43-57 zile

-15%