Embedded Mechatronic Systems: Analysis of Failures, Predictive Reliability
Editat de Abdelkhalak El Hami, Philippe Pougneten Limba Engleză Hardback – 14 noi 2019
- Provides a statistical approach to design optimization through reliability
- Presents an experimental approach for the characterization of the development of mechatronic systems in operating mode
- Analyzes new tools that effect thermal, vibratory, humidity, electric and electromagnetic stresses
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Specificații
ISBN-13: 9781785481895
ISBN-10: 1785481894
Pagini: 274
Dimensiuni: 152 x 229 mm
Greutate: 0.54 kg
Ediția:2
Editura: ELSEVIER SCIENCE
ISBN-10: 1785481894
Pagini: 274
Dimensiuni: 152 x 229 mm
Greutate: 0.54 kg
Ediția:2
Editura: ELSEVIER SCIENCE
Cuprins
1. Reliability-Based Design Optimization
2. Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices
3. Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities
4. Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques
5. Characterization of Switching Transistors under Electrical Overvoltage Stresses
6. Reliability OF Radio Frequency Power Transistors to Electromagnetic and Thermal Stress
7. Internal Temperature Measurement of Electronic Components
8. Reliability Prediction of Embedded Electronic Systems: the FIDES Guide
9. Study of the Dynamic Contact Between Deformable Solids
2. Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices
3. Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities
4. Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques
5. Characterization of Switching Transistors under Electrical Overvoltage Stresses
6. Reliability OF Radio Frequency Power Transistors to Electromagnetic and Thermal Stress
7. Internal Temperature Measurement of Electronic Components
8. Reliability Prediction of Embedded Electronic Systems: the FIDES Guide
9. Study of the Dynamic Contact Between Deformable Solids