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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® de Erdogan Madenci

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®: The Springer International Series in Engineering and Computer Science, cartea 719

Autor Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
en Limba Engleză Hardback – 31 dec 2002
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
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Specificații

ISBN-13: 9781402073304
ISBN-10: 1402073305
Pagini: 185
Ilustrații: XX, 185 p.
Dimensiuni: 155 x 235 x 17 mm
Greutate: 0.49 kg
Ediția:2003
Editura: Springer Us
Colecția Springer
Seria The Springer International Series in Engineering and Computer Science

Locul publicării:New York, NY, United States

Public țintă

Research

Cuprins

1 Introduction.- 1.1 Numerical Modeling with Finite Element Analysis.- 1.2 Constitutive Relations.- 1.3 Failure Prediction.- 1.4 References.- 2 Thermomechanical Fatigue Life Prediction Analysis.- 2.1 Approach.- 2.2 Analysis Steps.- 2.3 Case Study: BGA-Type Package.- 2.4 References.- 3 Mechanical Bending Fatigue Life Prediction Analysis.- 3.1 Approach.- 3.2 Analysis Steps.- 3.3 Case Study: BGA-Type Package.- 3.4 References.- 4 Macro Reference Library.- 4.1 Overview.- 4.2 Preprocessor.- 4.3 Solution.- 4.4 Postprocessing.- 4.5 Reference.- Appendix A: Installation and Execution.- A.1 Steps for ReliANS Installation on a PC Platform.- A.2 Steps for Adding Working Directories for Use in ReliANS.- A.3 Demonstration of ReliANS Installation and Adding New Directories.- A.4 Installation of ReliANS on UNIX Systems.- Appendix B: Input Listings for Case Studies.- B. 1 Input Listing for the Case Study Given in Chapter 2.- B.2 Input Listing for the Case Study Given in Chapter 3.

Recenzii

From the reviews:
"Fatigue Life Prediction of Solder Joints in Electronic Packages … excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. … there must by now be this book on the bookshelf of every one concerned with fatigue reliability analyses of solder joints which is an important issue in the electronics industry." (Current Engineering Practice, Vol. 47, 2002-2003)