Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

Autor Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

en Limba Engleză Hardback – 6 noi 2014

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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Specificații

ISBN-13: 9781461492658
ISBN-10: 1461492653
Pagini: 268
Ilustrații: XIII, 253 p. 151 illus., 81 illus. in color.
Dimensiuni: 155 x 235 x 20 mm
Greutate: 0.55 kg
Ediția:2015
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States

Public țintă

Research

Cuprins

Introduction.- Interconnection : The Joint.- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys.- Microstructure Development; Solidification and Isothermal Aging.- Thermal Cycling Performance.- Mechanical Stability and Performance.- Chemical and Environment Attack.- Challenges in Future Generation Interconnects: Microstructure Again.

Recenzii

From the book reviews:
“The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)

Textul de pe ultima copertă

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.
In summary, this book:

Provides an up-to-date overview on lead-free soldering technologies
Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique
Explores emerging technologies in lead-free soldering

Caracteristici

Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniques Explores emerging technologies in lead-free soldering Includes supplementary material: sn.pub/extras

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