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Materials for Advanced Packaging de Daniel Lu

Materials for Advanced Packaging

Editat de Daniel Lu, C.P. Wong
en Limba Engleză Paperback – 8 iun 2018
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.

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Specificații

ISBN-13: 9783319832098
ISBN-10: 3319832093
Ilustrații: XVI, 969 p. 700 illus., 440 illus. in color.
Dimensiuni: 155 x 235 mm
Greutate: 1.35 kg
Ediția:Softcover reprint of the original 2nd ed. 2017
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland

Cuprins

3D Integration Technologies – An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Fabrication and Applications to Wafer Level System Integration.- Advanced Substrates: A Materials and Processing Perspective.- Flip-Chip Underfill: Materials, Process and Reliability.- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes.- Wafer Level Chip Scale Packaging.- MEMS Packaging.- LED Die Bonding.- Medical Electronics Design, Manufacturing, and Reliability.- Flexible and Printed Electronics.- Silicon Solar Cell Metallization Pastes.- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices.- Characterization of Copper Diffusion in Through Silicon Vias.

Notă biografică

Dr. Daniel Lu is the Vice President of Technology, Henkel Corporation in Asia Pacific. Prior to joining Henkel, he worked for the R&D department of Intel Corp (Arizona, USA) as a Sr. Scientist for 7 years. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including the IEEE/CPMT Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, etc. Dr. Lu has published more than 50 journal papers, wrote chapters for six books, and holds more than 80 US and international patents. He is the editor of the book “Materials for Advanced Packaging (2008)” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies (2009)”. He has been serving key roles in organizing international electronic packaging conferences and teaching professional development courses in these conferences. Dr. Lu is a senior member of IEEE, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as an adjunct professor in Huazhong University of Science and Technology, and SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science. Dr. Lu has more 15 years of experience in electronic packaging and is an expert in electronic packaging materials and processing.

Professor C.P. Wong is with the School of Materials Sciences and Engineering at Georgia Tech (GT) and also is the Dean of Engineering, The Chinese University of Hong Kong. Prior to joining GT, he was with AT&T Bell Laboratories for many years and was an AT&T Bell Labs Fellow. His research interests focus on the areas of material and process for electronic, photonic, MEMS, sensors, and energy harvesting and storage. He has published over 1,000 technical papers, 12 books and holds over 65 US Patents. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.

Textul de pe ultima copertă

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including:
  •        Lead-free solders
  •         Flip chip underfills
  •         Epoxy molding compounds
  •         Conductive adhesives
  •         Die attach adhesives/films
  •         Thermal interface materials (TIMS)
  •         Materials for fabricating embedded passives including capacitors, inductors, and resistors
  •         Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS)
Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing.

Caracteristici

Provides a comprehensive summary of the most recent advances in materials development for advanced packaging Covers emerging technologies such as digital health, bio-medical and nano materials and process, and microelectronic and optoelectronic packaging Contains a balanced number of chapter authors from academia and industry, who are leaders in their respective fields