Materials for Advanced Packaging
Editat de Daniel Lu, C.P. Wongen Limba Engleză Hardback – 10 dec 2008
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Specificații
ISBN-13: 9780387782188
ISBN-10: 0387782184
Pagini: 719
Ilustrații: XII, 724 p. 300 illus.
Dimensiuni: 155 x 235 x 44 mm
Greutate: 1.18 kg
Ediția:2009
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
ISBN-10: 0387782184
Pagini: 719
Ilustrații: XII, 724 p. 300 illus.
Dimensiuni: 155 x 235 x 44 mm
Greutate: 1.18 kg
Ediția:2009
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States
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Public țintă
Professional/practitionerCuprins
3D Integration Technologies – An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.
Textul de pe ultima copertă
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.
This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:
New bonding and joining techniques
Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates
Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.
Materials and processing aspects on MEMS and wafer level chip scale packaging.
Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:
New bonding and joining techniques
Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates
Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.
Materials and processing aspects on MEMS and wafer level chip scale packaging.
Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
Caracteristici
Provides a comprehensive summary of the most recent advances in materials development for advanced packaging Covers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoelectronic packaging Discusses various types of materials including polymers, ceramics, metals, and solders Each chapter written by industry leaders
Notă biografică
Dr. Daniel Lu is the Vice President of Technology, Henkel Corporation in Asia Pacific. Prior to joining Henkel, he worked for the R&D department of Intel Corp (Arizona, USA) as a Sr. Scientist for 7 years. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including the IEEE/CPMT Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, etc. Dr. Lu has published more than 50 journal papers, wrote chapters for six books, and holds more than 80 US and international patents. He is the editor of the book “Materials for Advanced Packaging (2008)” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies (2009)”. He has been serving key roles in organizing international electronic packaging conferences and teaching professional development courses in these conferences. Dr. Lu is a senior member of IEEE, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as an adjunct professor in Huazhong University of Science and Technology, and SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science. Dr. Lu has more 15 years of experience in electronic packaging and is an expert in electronic packaging materials and processing.
Professor C.P. Wong is with the School of Materials Sciences and Engineering at Georgia Tech (GT) and also is the Dean of Engineering, The Chinese University of Hong Kong. Prior to joining GT, he was with AT&T Bell Laboratories for many years and was an AT&T Bell Labs Fellow. His research interests focus on the areas of material and process for electronic, photonic, MEMS, sensors, and energy harvesting and storage. He has published over 1,000 technical papers, 12 books and holds over 65 US Patents. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.