Micro-Relay Technology for Energy-Efficient Integrated Circuits: Microsystems and Nanosystems
Autor Hei Kam, Fred Chenen Limba Engleză Hardback – 20 oct 2014
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Specificații
ISBN-13: 9781493921270
ISBN-10: 1493921274
Pagini: 183
Ilustrații: X, 183 p. 167 illus., 56 illus. in color.
Dimensiuni: 155 x 235 x 15 mm
Greutate: 0.45 kg
Ediția:2015
Editura: Springer
Colecția Springer
Seria Microsystems and Nanosystems
Locul publicării:New York, NY, United States
ISBN-10: 1493921274
Pagini: 183
Ilustrații: X, 183 p. 167 illus., 56 illus. in color.
Dimensiuni: 155 x 235 x 15 mm
Greutate: 0.45 kg
Ediția:2015
Editura: Springer
Colecția Springer
Seria Microsystems and Nanosystems
Locul publicării:New York, NY, United States
Public țintă
Professional/practitionerCuprins
A New Era of Old Electronics.- Design and Modeling of Micro-Relay.- Micro-Relay Technologies.- Micro-Relay Reliability.- Optimization and Scaling of Micro-Relays for Ultra-Low-Power Digital Logic.- Integrated Circuit Design with Micro-Relays.- Micro-Relay Circuits for VLSI Applications.
Notă biografică
Fred Chen currently works at Lion Semiconductor, Inc. Hei Kam currently works at Intel Corporation and was formerly a graduate student at UC Berkeley.
Textul de pe ultima copertă
This book describes the design of relay-based circuit systems from device fabrication to circuit micro-architectures. This book is ideal for both device engineers as well as circuit system designers and highlights the importance of co-design across design hierarchies when optimizing system performance (in this case, energy-efficiency). This book is ideal for researchers and engineers focused on semiconductors, integrated circuits, and energy efficient electronics.
This book also:
· Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture, and CAD
· Describes work previously done in the field and also lays the groundwork and criteria for future energy-efficient device and system design
· Maximizes reader insights into the design and modeling of micro-relay, micro-relay reliability, integrated circuit design with micro-relays, and more
This book also:
· Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture, and CAD
· Describes work previously done in the field and also lays the groundwork and criteria for future energy-efficient device and system design
· Maximizes reader insights into the design and modeling of micro-relay, micro-relay reliability, integrated circuit design with micro-relays, and more
Caracteristici
Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture and CAD Describes work previously done in the field and also lays the groundwork and criteria for future energy-efficient device and system design Maximizes reader insights into the design and modeling of micro-relay, micro-relay reliability, integrated circuit design with micro-relays, and more