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Micro-Relay Technology for Energy-Efficient Integrated Circuits: Microsystems and Nanosystems

Autor Hei Kam, Fred Chen
en Limba Engleză Paperback – 23 aug 2016
This volume describes the design of relay-based circuit systems from device fabrication to circuit micro-architectures. This book is ideal for both device engineers as well as circuit system designers, and highlights the importance of co-design across design hierarchies when trying to optimize system performance (in this case, energy-efficiency). The book will also appeal to researchers and engineers focused on semiconductor, integrated circuits, and energy efficient electronics.
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Specificații

ISBN-13: 9781493954179
ISBN-10: 1493954172
Pagini: 183
Ilustrații: X, 183 p. 167 illus., 56 illus. in color.
Dimensiuni: 155 x 235 mm
Ediția:Softcover reprint of the original 1st ed. 2015
Editura: Springer
Colecția Springer
Seria Microsystems and Nanosystems

Locul publicării:New York, NY, United States

Cuprins

A New Era of Old Electronics.- Design and Modeling of Micro-Relay.- Micro-Relay Technologies.- Micro-Relay Reliability.- Optimization and Scaling of Micro-Relays for Ultra-Low-Power Digital Logic.- Integrated Circuit Design with Micro-Relays.- Micro-Relay Circuits for VLSI Applications.

Notă biografică

Fred Chen currently works at Lion Semiconductor, Inc. Hei Kam currently works at Intel Corporation and was formerly a graduate student at UC Berkeley.   

Textul de pe ultima copertă

This book describes the design of relay-based circuit systems from device fabrication to circuit micro-architectures. This book is ideal for both device engineers as well as circuit system designers and highlights the importance of co-design across design hierarchies when optimizing system performance (in this case, energy-efficiency). This book is ideal for researchers and engineers focused on semiconductors, integrated circuits, and energy efficient electronics.
This book also:
·         Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture, and CAD
·         Describes work previously done in the field and also lays the groundwork and criteria for future energy-efficient device and system design
·         Maximizes reader insights into the design and modeling of micro-relay, micro-relay reliability, integrated circuit design with micro-relays, and more

Caracteristici

Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture and CAD Describes work previously done in the field and also lays the groundwork and criteria for future energy-efficient device and system design Maximizes reader insights into the design and modeling of micro-relay, micro-relay reliability, integrated circuit design with micro-relays, and more