Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore: Woodhead Publishing Series in Electronic and Optical Materials
Autor Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhaoen Limba Engleză Paperback – 14 noi 2019
- Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
- Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
- Provides multiphysics modeling and analysis techniques of electronic packaging
Din seria Woodhead Publishing Series in Electronic and Optical Materials
- 24% Preț: 1160.66 lei
- 9% Preț: 912.54 lei
- 39% Preț: 1136.44 lei
- 9% Preț: 956.68 lei
- 24% Preț: 951.04 lei
- 9% Preț: 1335.64 lei
- 29% Preț: 986.78 lei
- 24% Preț: 874.56 lei
- 29% Preț: 1414.77 lei
- 29% Preț: 1075.95 lei
- 9% Preț: 1216.61 lei
- 39% Preț: 811.62 lei
- 29% Preț: 1193.77 lei
- 9% Preț: 1444.32 lei
- 24% Preț: 926.89 lei
- 9% Preț: 1107.16 lei
- 9% Preț: 1262.45 lei
- 9% Preț: 954.69 lei
- 9% Preț: 1006.73 lei
- 9% Preț: 958.65 lei
- 9% Preț: 948.72 lei
- 9% Preț: 1150.61 lei
- 23% Preț: 1493.72 lei
- 24% Preț: 1276.29 lei
- 9% Preț: 950.94 lei
- 29% Preț: 1333.73 lei
- 9% Preț: 901.22 lei
- 9% Preț: 1130.18 lei
- 9% Preț: 1049.49 lei
- 24% Preț: 871.12 lei
- 27% Preț: 1459.23 lei
- 20% Preț: 1071.49 lei
- 24% Preț: 932.11 lei
- 29% Preț: 1071.64 lei
- 24% Preț: 670.36 lei
- 9% Preț: 926.48 lei
- 23% Preț: 929.43 lei
- 9% Preț: 897.50 lei
- 9% Preț: 1276.81 lei
- 9% Preț: 957.63 lei
- 29% Preț: 845.10 lei
- 9% Preț: 953.05 lei
- 33% Preț: 1126.67 lei
- 29% Preț: 954.77 lei
- 24% Preț: 961.16 lei
- 23% Preț: 930.29 lei
- 23% Preț: 1080.19 lei
- 9% Preț: 1454.84 lei
Preț: 1072.07 lei
Preț vechi: 1406.44 lei
-24% Nou
Puncte Express: 1608
Preț estimativ în valută:
205.17€ • 212.38$ • 173.41£
205.17€ • 212.38$ • 173.41£
Carte tipărită la comandă
Livrare economică 27 februarie-13 martie
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9780081025321
ISBN-10: 0081025327
Pagini: 434
Dimensiuni: 152 x 229 x 30 mm
Greutate: 0.58 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
ISBN-10: 0081025327
Pagini: 434
Dimensiuni: 152 x 229 x 30 mm
Greutate: 0.58 kg
Editura: ELSEVIER SCIENCE
Seria Woodhead Publishing Series in Electronic and Optical Materials
Cuprins
1. Introduction
2. Electrical modeling and design
3. Thermal modeling, analysis, and design
4. Stress and reliability analysis for interconnects
5. Reliability and failure analysis of encapsulated packages
6. Thermal and mechanical tests for packages and materials
7. System-level modeling, analysis, and design
2. Electrical modeling and design
3. Thermal modeling, analysis, and design
4. Stress and reliability analysis for interconnects
5. Reliability and failure analysis of encapsulated packages
6. Thermal and mechanical tests for packages and materials
7. System-level modeling, analysis, and design