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Nanopackaging: Nanotechnologies and Electronics Packaging de James E. Morris

Nanopackaging: Nanotechnologies and Electronics Packaging

Editat de James E. Morris
en Limba Engleză Paperback – 4 noi 2010
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
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Specificații

ISBN-13: 9781441942906
ISBN-10: 1441942904
Pagini: 572
Dimensiuni: 155 x 235 x 30 mm
Greutate: 0.79 kg
Ediția:2008
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States

Public țintă

Research

Descriere

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Cuprins

Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Application of Molecular Dynamics Simulation in Electronic Packaging.- Advances in Delamination Modeling.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges.- Nanostructured Resistor Materials.- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging.- Nanoconductive Adhesives.- Nanoparticles in Microvias.- Materials and Technology for Conductive Microstructures.- A Study of Nanoparticles in SnAg-Based Lead-Free Solders.- Nano-Underfills for Fine-Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- Carbon Nanotubes for Thermal Management of Microsystems.- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes.- Nanowires in Electronics Packaging.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanoelectronics Landscape: Application, Technology, and Economy.- Errata.

Recenzii

From the reviews:“This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. … I am pleased to be able to conclude this … Nanopackaging: Nanotechnologies and Electronics Packaging as ‘highly recommended’.” (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)

Textul de pe ultima copertă

Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement.
Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including:
  • The importance of computer modeling in nanopackaging and offers suggestions for implementation
  • Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control
  • A comprehensive overview of nanoscale electronics and systems packaging
Nanopackaging: Nanotechnologies and Electronics Packagingis an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging.

Caracteristici

Offers a comprehensive discussion of Nanoparticles and Carbon Nanotubes, and how and why they are rapidly becoming materials options for electronics packaging
Discusses the importance of computer modeling in nanopackaging and offers suggestions for implementation
Discusses Nanoparticles and their role in packaging, including basic properties and fabrication, and applications in resistors, capacitors, inductors, microvias and conductive adhesives, solder, underfill, and thermal management
Discusses Carbon Nanotubes and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control
Brings together a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends

Notă biografică

James E. Morris is Professor of Electrical & Computer Engineering at Portland State University, Oregon. He has edited or co-authored five books on electronic packaging, and has more on the way.