Physical and Technical Problems of SOI Structures and Devices: NATO Science Partnership Subseries: 3, cartea 4
Editat de J.-P. Colinge, Vladimir S. Lysenko, Alexei N. Nazaroven Limba Engleză Paperback – 21 oct 2012
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Specificații
ISBN-13: 9789401040525
ISBN-10: 9401040524
Pagini: 304
Ilustrații: X, 290 p.
Dimensiuni: 160 x 240 x 16 mm
Greutate: 0.43 kg
Ediția:Softcover reprint of the original 1st ed. 1995
Editura: SPRINGER NETHERLANDS
Colecția Springer
Seria NATO Science Partnership Subseries: 3
Locul publicării:Dordrecht, Netherlands
ISBN-10: 9401040524
Pagini: 304
Ilustrații: X, 290 p.
Dimensiuni: 160 x 240 x 16 mm
Greutate: 0.43 kg
Ediția:Softcover reprint of the original 1st ed. 1995
Editura: SPRINGER NETHERLANDS
Colecția Springer
Seria NATO Science Partnership Subseries: 3
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
Soi Materials.- Low Dose SIMOX for ULSI Applications.- Why Porous Silicon for SOI?.- Defect Engineering in SOI Films Prepared by Zone-Melting Recrystallization.- Ion Beam Processing for Silicon-on-Insulator.- Semi-Insulating Oxygen-Doped Silicon by Low Temperature Chemical Vapor Deposition for SOI Applications.- Direct Formation of Thin Film Nitride Structures by High Intensity Ion Implantation of Nitrogen into Silicon.- Stimulated Technology for Implanted SOI Formation.- Behaviour of Oxygen and Nitrogen Atoms Sequentially Implanted into Silicon.- SOI Fabrication by Silicon Wafer Bonding with the Help of Glass-Layer Fusion.- Crystallization of a-Si Films on Glasses by Multipulse-Excimer-Laser Technique.- Microzone Laser Recrystallized Polysilicon Layers on Insulator.- Soi Materials Characterization Techniques.- Electrical Characterization Techniques for Silicon on Insulator Materials and Devices.- The Defect Structure of Buried Oxide Layers in SIMOX and BESOI Structures.- IR Study of Buried Layer Structure on Different Stages of Technology.- Optical Investigation of Silicon Implanted with High Doses of Oxygen and Hydrogen Ions.- Electrical Properties of ZMR SOI Structures: Characterization Techniques and Experimental Results.- Soi Devices.- Fabrication and Characterisation of Poly-Si TFTs on Glass.- Hot Carrier Reliability of SOI Structures.- Novel TESC Bipolar Transistor Approach for a Thin-Film Silicon-on-Insulator Substrate.- Problems of Radiation Hardness of SOI Structures and Devices.- Fabrication of SIMOX Structures and IC’s Test Elements.- Low-Frequency Noise Characterization of Silicon-on-Insulator Depletion-mode p-MOSFETS.- Soi Circuits.- SOI Devices and Circuits: An Overview of Potentials and Problems.- 1.2 µm CMOS/SOI on Porous Silicon.- SOI PressureSensors Based on Laser Recrystallized Polysilicon.