Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Autor ASME

en Limba Engleză Paperback – 27 feb 2020

A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.

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Specificații

ISBN-13: 9780791859322
ISBN-10: 0791859320
Pagini: 836
Dimensiuni: 279 x 215 x 48 mm
Greutate: 1.88 kg
Editura: American Society of Mechanical Engineers,U.S.