Cantitate/Preț
Produs

RF/Microwave Hybrids: Basics, Materials and Processes

Autor Richard Brown
en Limba Engleză Hardback – 31 dec 2002
In 1991 this author published a monograph[l] based on his experience teaching microwave hybrid materials and processing technology at the annual ISHM (now the International Microelectronics and Packaging Society, IMAPS) symposia. Since that time, the course has been presented at that venue and on-site at a number of industrial and government organizations. The course has been continually revised to reflect the many evolutionary changes in materials and processes. Microwave technology has existed for almost 175 years. It was only after the invention of the klystron, just before World War II, that microwave design and manufacture moved from a few visionaries to the growth the industry sees today. Over the last decade alone there have been exploding applications for all types of high frequency electronics in the miltary, automotive, wireless, computer, telecommunications and medical industries. These have placed demands, unimaginable a decade ago, on designs, materials, processes and equipment to meet the ever expanding requirements for increasingly reliable, smaller, faster and lower cost circuits.
Citește tot Restrânge

Toate formatele și edițiile

Toate formatele și edițiile Preț Express
Paperback (1) 92553 lei  6-8 săpt.
  Springer Us – 7 dec 2010 92553 lei  6-8 săpt.
Hardback (1) 93219 lei  6-8 săpt.
  Springer Us – 31 dec 2002 93219 lei  6-8 săpt.

Preț: 93219 lei

Preț vechi: 113681 lei
-18% Nou

Puncte Express: 1398

Preț estimativ în valută:
17838 18767$ 14769£

Carte tipărită la comandă

Livrare economică 14-28 ianuarie 25

Preluare comenzi: 021 569.72.76

Specificații

ISBN-13: 9781402072338
ISBN-10: 1402072333
Pagini: 308
Ilustrații: XVI, 284 p.
Dimensiuni: 156 x 234 x 22 mm
Greutate: 0.62 kg
Ediția:2003
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States

Public țintă

Research

Cuprins

Hybrids vs. Mimics.- Basic Concepts.- Planar Waveguides.- Current Flow and Loss Considerations.- Substrates.- Thick Film.- Thin Film.- Dielectric Deposition.- Polymers.- Processing Strategies.- Photolithigraphy.- Electroplating.- Etching.- Components.- Packaging.- Superconductivity.- Microelectromechnicalsystems-MEMS.