Cantitate/Preț
Produs

Silicon Devices and Process Integration: Deep Submicron and Nano-Scale Technologies

Autor Badih El-Kareh
en Limba Engleză Hardback – 12 ian 2009
Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author’s industrial and academic lecture notes and reflects years of experience in the development of silicon devices.
Features include:
  • A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
  • State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
  • CMOS-only applications, such as subthreshold current and parasitic latch-up;
  • Advanced Enabling processes and process integration.
This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Citește tot Restrânge

Toate formatele și edițiile

Toate formatele și edițiile Preț Express
Paperback (1) 69844 lei  43-57 zile
  Springer Us – 29 oct 2010 69844 lei  43-57 zile
Hardback (1) 94669 lei  43-57 zile
  Springer Us – 12 ian 2009 94669 lei  43-57 zile

Preț: 94669 lei

Preț vechi: 115451 lei
-18% Nou

Puncte Express: 1420

Preț estimativ în valută:
18118 18820$ 15049£

Carte tipărită la comandă

Livrare economică 03-17 februarie 25

Preluare comenzi: 021 569.72.76

Specificații

ISBN-13: 9780387367989
ISBN-10: 0387367985
Pagini: 597
Ilustrații: XXVI, 598 p.
Dimensiuni: 155 x 235 x 33 mm
Greutate: 1.04 kg
Ediția:2009
Editura: Springer Us
Colecția Springer
Locul publicării:New York, NY, United States

Public țintă

Professional/practitioner

Cuprins

Properties of the Silicon Crystal. Valence-bond and energy-band models. Thermal equilibrium statistics. Carrier transport mechanisms. Non-equilibrium conditions and carrier lifetime.- Junctions and Contacts. Ohmic, non-ohmic, and rectifying contacts. PN junctions, homo- and hetero-junctions. Contact und junction characterization, parameter extraction. Varactors.- Junction Field-Effect Transistor, JFET. Structure and mode of operation. Physics of JFET. JFET characterization and parameter extraction. High-voltage applications. Parasitic effects.- Bipolar Junction Transistor, BJT. Structure and mode of operation. Physics of BJT. Heterojunction Bipolar Transistor, HBT. Transistor characterization and parameter extraction. High-voltage applications.- Parasitic effects.

Textul de pe ultima copertă

Silicon Devices and Process Integration is compiled from industrial and academic lecture notes and reflects years of experience in the development of silicon devices. It is prepared specifically for engineers and scientists in semiconductor research, development and manufacturing. It is also suitable for a one-semester course in electrical engineering and materials science at the upper undergraduate or lower graduate level. The book covers both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions.
Topics covered include: MOS structure, parameter extraction - Short and narrow-channel effects - CMOS mobility enhancement techniques - High-K gate dielectrics, advanced gate stacks - Low-K dielectrics and Cu interconnects - Analog devices and passive components - CMOS and BiCMOS process integration - DRAM, SRAM and NVM cell structures.
The book covers state-of-the-art silicon devices and integrated process technologies. It represents a comprehensive discussion of modern silicon devices, their characteristics, and interactions with process parameters.

Caracteristici

Focuses on process integration techniques and technology Addresses both raw silicon material and demonstrates their use in components Includes supplementary material: sn.pub/extras