Cantitate/Preț
Produs
Total produse
Vezi coșul
Thermal Contact Conductance de Chakravarti V. Madhusudana

Thermal Contact Conductance: Mechanical Engineering Series

Autor Chakravarti V. Madhusudana
en Limba Engleză Paperback – 23 aug 2016
The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.
Citește tot Restrânge

Toate formatele și edițiile

Toate formatele și edițiile Preț Express
Paperback (1) 71136 lei  6-8 săpt.
  Springer International Publishing – 23 aug 2016 71136 lei  6-8 săpt.
Hardback (1) 63033 lei  6-8 săpt.
  Springer International Publishing – 7 oct 2013 63033 lei  6-8 săpt.

Din seria Mechanical Engineering Series

Preț: 71136 lei

Preț vechi: 86752 lei
-18% Nou

Puncte Express: 1067
Preț estimativ în valută:
13614€ • 14141$ • 11308£

Carte tipărită la comandă

Livrare economică 01-15 februarie 25

 Adaugă în coș

Wish list
Gift list
Am citit!
Adaugă în listă
Preluare comenzi: 021 569.72.76

Specificații

ISBN-13: 9783319374284
ISBN-10: 3319374281
Pagini: 278
Ilustrații: XVIII, 260 p. 133 illus., 17 illus. in color.
Dimensiuni: 155 x 235 x 15 mm
Greutate: 0.4 kg
Ediția:Softcover reprint of the original 2nd ed. 2014
Editura: Springer International Publishing
Colecția Springer
Seria Mechanical Engineering Series

Locul publicării:Cham, Switzerland

Cuprins

Introduction.- Thermal Constriction Resistance.- Solid Spot Thermal Conductance of a Joint.- Gap Conductance at the Interface.-Experimental Aspects.- Special Configurations and Processes.- Control of Thermal Contact Conductance Using Interstitial Materials and Coatings.- Major Applications.- Additional Topics.- Concluding Remarks.

Recenzii

Reviewer 1:
The composition of the book follows a classic outline. It includes comprehensive theoretical insight into the phenomenon of TCC which establishes the links between the main physical characteristics determining TCC (properties of materials, surfaces and interstitial media), in the form of non-dimensional correlations. This allows the author to present TCC for variety of different materials in a simple form. It provides a summary of the experimental methods, collates and classifies information on the performance of different joints, hereby giving a useful update on the status of the field over half a century. Thus, the book is a good source of basic academic knowledge on TCC.
 
Reviewer 2:
This book would most certainly serve as a reference book; libraries of universities from all over the world should certainly buy it. Students can use it to learn the basic analytical methods and the experimental set-ups used.
 
Reviewer 3:
The whole style of this book, including illustrations is used very well.  The examples are very vivid.  It is easy to understand for machinery and materials processing engineering undergraduate students and masters.

Notă biografică

Professor Madhusudana is currently working out of Sudney, Australia

Textul de pe ultima copertă

This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. The material included in this edition has been updated to reflect the latest advances in the field.

Caracteristici

Includes numerous new heat transfer applications Describes a generalised approach for determining solid spot conductance Expanded transient measurements including the laser flash method Includes supplementary material: sn.pub/extras