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Thermal Design of Liquid Cooled Microelectronic Equipment: ASME Press Book Series on Electronic Packaging

Autor Yeh Lian-Tuu
en Limba Engleză Hardback – 30 iul 2019
Focuses on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analogue devices.
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Specificații

ISBN-13: 9780791861936
ISBN-10: 0791861937
Pagini: 350
Dimensiuni: 152 x 229 x 21 mm
Greutate: 0.63 kg
Editura: Life Raft Media Ltd
Seria ASME Press Book Series on Electronic Packaging