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Thermal Reliability of Power Semiconductor Device in the Renewable Energy System de Xiong Du

Thermal Reliability of Power Semiconductor Device in the Renewable Energy System: CPSS Power Electronics Series

Autor Xiong Du, Jun Zhang, Gaoxian Li, Yaoyi Yu, Cheng Qian, Rui Du
en Limba Engleză Paperback – 9 iul 2023
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 
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Specificații

ISBN-13: 9789811931345
ISBN-10: 9811931348
Pagini: 172
Ilustrații: XVI, 172 p. 121 illus., 94 illus. in color.
Dimensiuni: 155 x 235 mm
Ediția:1st ed. 2022
Editura: Springer Nature Singapore
Colecția Springer
Seria CPSS Power Electronics Series

Locul publicării:Singapore, Singapore

Cuprins

Introduction.- Thermal fatigue failure mechanism of power devices in renewable energy system.- Thermal model and thermal parameters monitoring.- Thermal analysis of power semiconductor device in renewable energy system.- Multi-time scale lifetime evaluation for the device in the renewable application.- Thermal management design and optimization.- Prospect.

Notă biografică

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.

Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

Textul de pe ultima copertă

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

Caracteristici

Focuses on the thermal reliability of power semiconductor device in the renewable energy system Offers abundant experimental tests to explain the device thermal reliability improvement techniques Discusses the development trend and future expectations of power semiconductor device thermal reliability