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3D Integration in VLSI Circuits: Implementation Technologies and Applications de Katsuyuki Sakuma

3D Integration in VLSI Circuits: Implementation Technologies and Applications: Devices, Circuits, and Systems

Editat de Katsuyuki Sakuma
en Limba Engleză Hardback – 24 apr 2018
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe.
  • Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC.
  • Discusses the use of silicon interposer and organic interposer.
  • Presents architecture, design, and technology implementations for 3D FPGA integration.
  • Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding.
  • Addresses the issue of thermal dissipation in 3D integration.
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Specificații

ISBN-13: 9781138710399
ISBN-10: 1138710393
Pagini: 233
Ilustrații: 15 Line drawings, color; 100 Line drawings, black and white; 10 Halftones, color; 48 Halftones, black and white; 15 Tables, black and white
Dimensiuni: 156 x 234 x 18 mm
Greutate: 0.52 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Devices, Circuits, and Systems

Locul publicării:Boca Raton, United States

Cuprins

Three-Dimensional Integration: Technology and Design. Three-Dimensional System-in-Package for Application-Specific Integrated Circuit and Three-Dimensional Dynamic Random-Access Memory Integration. A New Class of High-Capacity, Resource-Rich Field-Programmable Gate Arrays Enabled by Three- Dimensional Integration Chip-Stacked Silicon Interconnect Technology. Challenges in 3D Integration. Wafer-Level Three-Dimensional Integration Using Bumpless Interconnects and Ultrathinning. Three-Dimensional Integration Stacking Technologies for High-Volume Manufacturing by Use of Wafer-Level Oxide-Bonding Integration. Toward Three-Dimensional High Density. Novel Platforms and Applications Using Three-Dimensional and Heterogeneous Integration Technologies.

Recenzii

"With the increasing cost and power issues associated with continuing along the traditional road of 2D scaling, 3D integration is becoming an essential enabler for performance gains in future VLSI nodes. This book provides an insightful treatment of the challenges and opportunities for intelligently evolving 3D integration into volume manufacturing and the applications that will exploit this exciting technology."
—David Danovitch, Université de Sherbrooke, Canada
"The chapter authors are the world’s leading scientists and experts in this field and they cover the state-of-the-art topics that the readers really want."
— James J.-Q. Lu, Rensselaer Polytechnic Institute, USA

Descriere

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs.