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Design for Manufacturability with Advanced Lithography

Autor Bei Yu, David Z. Pan
en Limba Engleză Paperback – 23 aug 2016
This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
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Specificații

ISBN-13: 9783319373935
ISBN-10: 3319373935
Pagini: 164
Ilustrații: XI, 164 p.
Dimensiuni: 155 x 235 mm
Greutate: 0.26 kg
Ediția:Softcover reprint of the original 1st ed. 2016
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland

Cuprins

Introduction.- Layout Decomposition for Triple Patterning.- Layout Decomposition for Other Patterning Techniques.- Standard Cell Compliance and Placement Co-Optimization.- Design for Manufacturability with E-Beam Lithography.- Conclusions and Future Works.-

Textul de pe ultima copertă

This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL).  The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography.  Unlike books that discuss DFM from the product level, or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
  • Enables readers to tackle the challenge of layout decompositions for different patterning techniques;
  • Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design;
  • Includes coverage of the design for manufacturability with E-Beam lithography.

Caracteristici

Enables readers to tackle the challenge of layout decompositions for different patterning techniques Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design Includes coverage of the design for manufacturability with E-Beam lithography