Design for Manufacturability with Advanced Lithography
Autor Bei Yu, David Z. Panen Limba Engleză Paperback – 23 aug 2016
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Springer International Publishing – 23 aug 2016 | 367.10 lei 6-8 săpt. | |
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Springer International Publishing – 23 noi 2015 | 373.93 lei 6-8 săpt. |
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Specificații
ISBN-13: 9783319373935
ISBN-10: 3319373935
Pagini: 164
Ilustrații: XI, 164 p.
Dimensiuni: 155 x 235 mm
Greutate: 0.26 kg
Ediția:Softcover reprint of the original 1st ed. 2016
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland
ISBN-10: 3319373935
Pagini: 164
Ilustrații: XI, 164 p.
Dimensiuni: 155 x 235 mm
Greutate: 0.26 kg
Ediția:Softcover reprint of the original 1st ed. 2016
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland
Cuprins
Introduction.- Layout Decomposition for Triple Patterning.- Layout Decomposition for Other Patterning Techniques.- Standard Cell Compliance and Placement Co-Optimization.- Design for Manufacturability with E-Beam Lithography.- Conclusions and Future Works.-
Textul de pe ultima copertă
This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level, or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.
- Enables readers to tackle the challenge of layout decompositions for different patterning techniques;
- Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design;
- Includes coverage of the design for manufacturability with E-Beam lithography.
Caracteristici
Enables readers to tackle the challenge of layout decompositions for different patterning techniques Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design Includes coverage of the design for manufacturability with E-Beam lithography