Electrical Characterization of Silicon-on-Insulator Materials and Devices: The Springer International Series in Engineering and Computer Science, cartea 305
Autor Sorin Cristoloveanu, Sheng Lien Limba Engleză Paperback – 23 feb 2014
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Paperback (1) | 1196.91 lei 43-57 zile | |
Springer Us – 23 feb 2014 | 1196.91 lei 43-57 zile | |
Hardback (1) | 1202.93 lei 43-57 zile | |
Springer Us – 30 iun 1995 | 1202.93 lei 43-57 zile |
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Specificații
ISBN-13: 9781461359456
ISBN-10: 1461359457
Pagini: 400
Ilustrații: XV, 381 p.
Dimensiuni: 155 x 235 x 21 mm
Greutate: 0.56 kg
Ediția:Softcover reprint of the original 1st ed. 1995
Editura: Springer Us
Colecția Springer
Seria The Springer International Series in Engineering and Computer Science
Locul publicării:New York, NY, United States
ISBN-10: 1461359457
Pagini: 400
Ilustrații: XV, 381 p.
Dimensiuni: 155 x 235 x 21 mm
Greutate: 0.56 kg
Ediția:Softcover reprint of the original 1st ed. 1995
Editura: Springer Us
Colecția Springer
Seria The Springer International Series in Engineering and Computer Science
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
Preface.- 1 Introduction.- 1.1 Why SOI ?.- 1.2 Why Not Yet SOI ?.- 1.3 Why an SOI Book?.- 2 Methods of Forming SOI Wafers.- 2.1 SIMOX.- 2.2 Wafer Bonding.- 2.3 Zone-Melting Recrystallization.- 2.4 Epitaxial Lateral Overgrowth.- 2.5 Full Isolation by Porous Oxidized Silicon.- 2.6 Silicon on Sapphire.- 2.7 Silicon on Zirconia.- 3 SOI Devices.- 3.1 Advanced CMOS and Bipolar Devices.- 3.2 Radiation-Hardened Circuits.- 3.3 High-Voltage Devices.- 3.4 High-Temperature Devices.- 3.5 Low-Power Applications.- 3.6 Three-Dimensional Devices.- 3.7 Transducers.- 3.8 Innovative Devices.- 4 Wafer-Screening Techniques.- 4.1 The Basis for Wafer Screening.- 4.2 Surface Photovoltage.- 4.3 Dual-Beam S-Polarized Reflectance.- 4.4 Dual-Beam Optical Modulation.- 4.5 Other Optical Methods.- 4.6 Point Contact Pseudo-MOS Transistor.- 4.7 Quick-Turnaround Capacitance.- 4.8 Pinhole Detection.- 4.9 Conclusion.- 5 Transport Measurements.- 5.1 Four-Point Probe.- 5.2 Spreading Resistance.- 5.3 Hall Effect and Magnetoresistance.- 5.4 Van der Pauw Measurements.- 5.5 Photoconductivity.- 5.6 PICTS.- 6 SIS Capacitor-Based Characterization Techniques.- 6.1 Capacitance and Conductance Techniques.- 6.2 Bias-Scan DLTS Technique.- 6.4 Zerbst Method and Generation Lifetime.- 6.5 MOS Capacitance Method.- 7 Diode Measurements.- 7.1 Current—Voltage Measurements in a P—N Diode.- 7.2 Differential Current/Capacitance Method.- 7.3 Gated-Diode Measurements.- 7.4 Deep-Level Transient Spectroscopy.- 8 Electrical Characterization of SOI Materials and Devices MOS Transistor Characteristics.- 9 Transistor-Based Characterization Techniques.- List of Symbols.