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RF and Microwave Microelectronics Packaging II de Ken Kuang

RF and Microwave Microelectronics Packaging II

Editat de Ken Kuang, Rick Sturdivant
en Limba Engleză Paperback – 9 iun 2018
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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Specificații

ISBN-13: 9783319847191
ISBN-10: 3319847198
Ilustrații: XII, 172 p. 127 illus., 77 illus. in color.
Dimensiuni: 155 x 235 mm
Greutate: 0.27 kg
Ediția:Softcover reprint of the original 1st ed. 2017
Editura: Springer International Publishing
Colecția Springer
Locul publicării:Cham, Switzerland

Cuprins

Chapter1. Introduction to RF and Microwave Microelectronic Packaging.- Chapter2. Packaging of Transmit/Receive Modules.- Chapter3. 3D Transitions and Connections.- Chapter4. Electromagnetic Shielding for RF & Microwave Packages.- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate.- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package.- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices.- Chapter8. The challenge in packaging and assembly the advanced power amplifiers.- Chapter9. High Thermal Conductivity Materials – Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond.- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging.- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.

Notă biografică

Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in San Diego Business Journal 100 Fastest Growing Private Companies in San Diego. Kuang was three times the finalist for the Most Admired CEO in San Diego. 

Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.

Textul de pe ultima copertă

  • Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis
  • Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies
  • Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers


This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Caracteristici

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers Includes supplementary material: sn.pub/extras