Three-Dimensional Design Methodologies for Tree-based FPGA Architecture: Lecture Notes in Electrical Engineering, cartea 350
Autor Vinod Pangracious, Zied Marrakchi, Habib Mehrezen Limba Engleză Paperback – 19 oct 2016
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Paperback (1) | 625.20 lei 6-8 săpt. | |
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Springer International Publishing – 8 iul 2015 | 631.27 lei 6-8 săpt. |
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Specificații
ISBN-13: 9783319386874
ISBN-10: 3319386875
Pagini: 247
Ilustrații: XXI, 226 p. 113 illus., 102 illus. in color.
Dimensiuni: 155 x 235 x 13 mm
Greutate: 0.35 kg
Ediția:Softcover reprint of the original 1st ed. 2015
Editura: Springer International Publishing
Colecția Springer
Seria Lecture Notes in Electrical Engineering
Locul publicării:Cham, Switzerland
ISBN-10: 3319386875
Pagini: 247
Ilustrații: XXI, 226 p. 113 illus., 102 illus. in color.
Dimensiuni: 155 x 235 x 13 mm
Greutate: 0.35 kg
Ediția:Softcover reprint of the original 1st ed. 2015
Editura: Springer International Publishing
Colecția Springer
Seria Lecture Notes in Electrical Engineering
Locul publicării:Cham, Switzerland
Cuprins
An Overview of Three-Dimensional Integration and FPGAs.- Three-Dimensional Integration: A More Than Moore Technology.- Field Programmable Gate Arrays: An Overview.- Two Dimensional FPGAs: Configuration and CAD Flow.- Three-Dimensional FPGAs: Configuration and CAD Development.- Three-Dimensional Tree-based FPGA: Architecture Exploration Tools and Technologies.- Three-Dimensional Thermal Modeling: Tools and Methodologies.- Physical Design and Implementation of 3D Tree-based FPGAs.- Three-Dimensional FPGAs: Future Lines of Research.
Textul de pe ultima copertă
This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Caracteristici
A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, area and logic density of modern FPGA designs Provides a foundation for building 3D reconfigurable devices which meets the requirements of today's prototyping and manufacturing industry Includes supplementary material: sn.pub/extras