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Hardening Semiconductor Components Against Radiation and Temperature

Autor William R. Dawes
en Limba Engleză Hardback – 30 dec 1990
This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.
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Specificații

ISBN-13: 9780815512127
ISBN-10: 0815512120
Pagini: 340
Dimensiuni: 152 x 229 x 21 mm
Greutate: 0.81 kg
Ediția:New.
Editura: ELSEVIER SCIENCE

Public țintă

Semiconductor manufacturers, engineers, researchers, and management.

Cuprins

Interaction of Hazardous Environments with Electronic DevicesHardened Technologies for Hazardous EnvironmentsCircuit Design for Reliable Operations in Hazardous EnvironmentsPackaging, Testing, and Hardness Assurance