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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612: MRS Proceedings

Editat de G. S. Oehrlein, K. Maex, Y. -C. Joo, S. Ogawa, J. T. Wetzel
en Limba Engleză Paperback – 4 iun 2014
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
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Specificații

ISBN-13: 9781107413153
ISBN-10: 110741315X
Pagini: 614
Dimensiuni: 152 x 229 x 32 mm
Greutate: 0.81 kg
Editura: Cambridge University Press
Colecția Cambridge University Press
Seria MRS Proceedings

Locul publicării:New York, United States

Descriere

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.