Semiconductor Devices in Harsh Conditions: Devices, Circuits, and Systems
en Paperback – 29 sep 2020
With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.
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Specificații
ISBN-13: 9780367656362
ISBN-10: 0367656361
Pagini: 234
Dimensiuni: 233 x 156 x 24 mm
Greutate: 0.37 kg
Editura: Taylor & Francis Ltd.
Seria Devices, Circuits, and Systems
ISBN-10: 0367656361
Pagini: 234
Dimensiuni: 233 x 156 x 24 mm
Greutate: 0.37 kg
Editura: Taylor & Francis Ltd.
Seria Devices, Circuits, and Systems
Cuprins
Section I Radiation. Commercial Off-the-Shelf Components in Space Applications. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues. Simulation of Single-Event Effects on Fully Depleted Siliconon-Insulator (FDSOI) CMOS. Section II Sensors and Operating Conditions. Electronic Sensors for the Detection of Ovarian Cancer. Sensors and Sensor Systems for Harsh Environment Applications. III-Nitride Electronic Devices for Harsh Environments. Section III Packaging and System Design. Packaging for Systems in Harsh Environments. Corrosion Resistance of Lead-Free Solders under Environmental Stress. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via.