Semiconductor Devices in Harsh Conditions: Devices, Circuits, and Systems
Editat de Kirsten Weide-Zaage, Malgorzata Chrzanowska-Jeskeen Limba Engleză Hardback – 21 noi 2016
With a focus on radiation, operating conditions, sensor systems, package, and system design, the book is divided into three parts. The first part deals with sensing devices designed for operating in the presence of radiation, commercials of the shelf (COTS) products for space computing, and influences of single event upset. The second covers system and package design for harsh operating conditions. The third presents devices for biomedical applications under moisture and temperature loads in the frame of sensor systems and operating conditions.
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Specificații
ISBN-13: 9781498743808
ISBN-10: 1498743803
Pagini: 256
Ilustrații: 121
Dimensiuni: 156 x 234 x 19 mm
Greutate: 0.64 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Devices, Circuits, and Systems
ISBN-10: 1498743803
Pagini: 256
Ilustrații: 121
Dimensiuni: 156 x 234 x 19 mm
Greutate: 0.64 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Devices, Circuits, and Systems
Cuprins
Section I Radiation. Commercial Off-the-Shelf Components in Space Applications. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues. Simulation of Single-Event Effects on Fully Depleted Siliconon-Insulator (FDSOI) CMOS. Section II Sensors and Operating Conditions. Electronic Sensors for the Detection of Ovarian Cancer. Sensors and Sensor Systems for Harsh Environment Applications. III-Nitride Electronic Devices for Harsh Environments. Section III Packaging and System Design. Packaging for Systems in Harsh Environments. Corrosion Resistance of Lead-Free Solders under Environmental Stress. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via.
Notă biografică
Kirsten Weide-Zaage, Malgorzata Chrzanowska-Jeske
Recenzii
"Engineers are developing electronic systems for applications in environments significantly more taxing than those seen in classical computing applications. This book exposes engineers to the range of challenges faced and fosters an understanding of the approaches useful to succeed in those taxing application environments. It has an outstanding overview of the challenges to design electronic systems to operate in the presence of hazards in extreme environments."
—Klaus Schuegraf, Cymer, San Diego, California, USA
—Klaus Schuegraf, Cymer, San Diego, California, USA
Descriere
The book focuses on radiation, operating conditions, sensor systems, and package and system design.